Novel RF circuits using MEMS devices and silicon micromachining Conference Paper

abstract

• Summary form only given. The evolution of on-wafer packaging using Si micromachining is still in its infancy. In addition to the use of on-wafer packaging, the use of MEMS for the development of high-performance, low-cost circuit components that can be integrated in a three dimensional environment has revolutionized circuit architectures. The article presents a summary of the work at the University of Michigan in MEMS switches for microwave and mm-wave applications. An insertion loss of only 0.02 dB at 10-30 GHz is measured, while high isolation (150 dB) has been achieved by use of tuned switch packages for 20-40 GHz applications. The article concludes with the use of MEMS switches in tunable filters.

name of conference

• IEEE Antennas and Propagation Society International Symposium. Transmitting Waves of Progress to the Next Millennium. 2000 Digest. Held in conjunction with: USNC/URSI National Radio Science Meeting (Cat. No.00CH37118)

authors

• Katehi, Linda

published proceedings

• IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, VOLS 1-4

author list (cited authors)

• Katehi, L., & Rebeiz, G.

citation count

• 0

complete list of authors

• Katehi, LPB||Rebeiz, G

publication date

• January 2000

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 0.02 Db
• 10 To 30 Ghz
• 20 To 40 Ghz
• Circuit Architectures
• Circuits
• Ehf
• Elemental Semiconductor
• Elemental Semiconductors
• High-performance Circuit Components
• Insertion Loss
• Integrated Circuit Packaging
• Low-cost Circuit Components
• Mems Devices
• Mems Switches
• Microelectromechanical Devices
• Micromachining
• Micromechanical Devices
• Microswitches
• Microwave Applications
• Microwave Filters
• Microwave Integrated Circuits
• Microwave Switches
• Millimetre Wave Integrated Circuits
• Mm-wave Applications
• Mmic
• On-wafer Packaging
• Packaging
• Radio Frequency
• Rf Circuits
• Shf
• Si
• Silicon
• Silicon Micromachining
• Switches
• Tunable Filters
• Tuned Switch Packages
• University Of Michigan

Digital Object Identifier (DOI)

• 10.1109/aps.2000.874313

International Standard Book Number (ISBN) 10

• 0-7803-6370-1

start page

• 1246

end page

• 1246

volume

• 3

URL

• http://dx.doi.org/10.1109/aps.2000.874313