Isolation in three-dimensional integrated circuits Conference Paper

abstract

• The necessity for design of ICs with higher density makes the issue of circuit isolation a very important one. In multilayer structures, surface waves excited by planar discontinuities induce parasitic currents on adjoining interconnects. This parasitic coupling becomes a limiting factor as density increases and size reduces. The dependence of these proximity effects on interconnect geometry is the subject of this study. The previously suggested method of increasing isolation by introducing micromachined cavities in the common substrate is utilized. Various configurations of finite ground microstrip lines (MS) and finite ground coplanar waveguides (FGCPW) have been studied. Theoretical and experimental results, in terms of reduced isolation, are presented showing the advantages of the simultaneous use of FGCPW and MS in high-density circuits.

name of conference

• 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)

authors

• Katehi, Linda

published proceedings

• 2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3

author list (cited authors)

• Margomenos, A., Valas, S., Herman, M. I., & Katehi, L.

citation count

• 3

complete list of authors

• Margomenos, A||Valas, S||Herman, MI||Katehi, LPB

publication date

• January 2000

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE MTT-S International Microwave Symposium digest. IEEE MTT-S International Microwave Symposium  Journal

keywords

• Circuit Isolation
• Coplanar Waveguides
• Coupling Circuits
• Electromagnetic Coupling
• Electromagnetic Waveguides
• Fabrication
• Finite Ground Coplanar Waveguides
• Finite Ground Microstrip Lines
• Frequency
• High-density Circuits
• Ic Design
• Integrated Circuit Design
• Integrated Circuit Interconnections
• Interconnect Geometry
• Micromachined Cavities
• Microstrip
• Microstrip Lines
• Mmic
• Multilayer Structures
• Nonhomogeneous Media
• Parasitic Coupling
• Parasitic Currents
• Planar Discontinuities
• Surface Waves
• Three-dimensional Integrated Circuits

Digital Object Identifier (DOI)

• 10.1109/mwsym.2000.862347

International Standard Book Number (ISBN) 10

• 0-7803-5687-X

start page

• 1875

end page

• 1878

volume

• 3

URL

• http://dx.doi.org/10.1109/mwsym.2000.862347