A fully packaged finite-ground coplanar line-to-micromachined waveguide transition Conference Paper

abstract

• A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.

name of conference

• IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)

authors

• Katehi, Linda

published proceedings

• ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING

author list (cited authors)

• Becker, J. P., Lee, Y., East, J. R., & Katehi, L.

citation count

• 2

complete list of authors

• Becker, JP||Lee, Y||East, JR||Katehi, LPB

publication date

• January 2000

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 26.5 To 40 Ghz
• 56 To 100 Ghz
• Circuit Simulation
• Coplanar Transmission Lines
• Coplanar Waveguides
• Dielectric Losses
• Electromagnetic Waveguides
• Full-wave Simulations
• Integrated Circuit Packaging
• Ka-band Transition
• Metal Waveguide
• Micromachining
• Mmic
• Modified Simulation Structure
• Packaged Finite-ground Coplanar Line-to-micromachined Waveguide Transition
• Packaged Planar Line-to-silicon Micromachined Waveguide Transition
• Packaged Silicon Waveguide
• Packaging
• Planar Waveguides
• Probes
• Rectangular Waveguides
• Si
• Silicon
• W-band Design Transfer
• Waveguide Components
• Waveguide Discontinuities
• Waveguide Transitions

Digital Object Identifier (DOI)

• 10.1109/epep.2000.895544

International Standard Book Number (ISBN) 10

• 0-7803-6450-3

start page

• 273

end page

• 276

URL

• http://dx.doi.org/10.1109/epep.2000.895544