Interconnects for a Multi-Layer Three-Dimensional Silicon Architecture Conference Paper uri icon

abstract

  • As low cost and low volume gain increasing importance in today's technology market, the development of a silicon micro-machined multi-layer transmit module has become a worthwhile endeavor. In this architecture, the MMICs are flip-chip bonded and the 94 GHz signal is distributed both laterally and vertically through three silicon layers resulting in excitation of a four by four array of patch antennas. This module is 6 mm in length, 6 mm in width, 1 mm in height, and represents the first W-band transmit module to date. The details of the passive components and interconnects will be presented in this paper.

name of conference

  • 30th European Microwave Conference, 2000

published proceedings

  • 30th European Microwave Conference, 2000

author list (cited authors)

  • Herrick, K. J., Kihm, R. T., & Katehi, L.

citation count

  • 5

complete list of authors

  • Herrick, Katherine J||Kihm, Robert T||Katehi, Linda PB

publication date

  • October 2000