Novel low loss wide-band multi-port integrated circuit technology for RF/microwave applications Conference Paper uri icon

abstract

  • In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on a high resistivity silicon wafer. In particular, the fabrication process for deposition of spin-on-glass (SOG) as a dielectric layer, etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).

name of conference

  • 2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496)

published proceedings

  • 2001 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, DIGEST OF PAPERS

author list (cited authors)

  • Simons, R. N., Goverdhanam, K., & Katehi, L.

citation count

  • 4

complete list of authors

  • Simons, RN||Goverdhanam, K||Katehi, LPB

publication date

  • January 2001