MEMS and Si micromachined circuits for high-frequency applications Academic Article

abstract

• RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits.

authors

• Katehi, Linda

published proceedings

• IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

altmetric score

• 6

author list (cited authors)

• Katehi, L., Harvey, J. F., & Brown, E.

citation count

• 80

complete list of authors

• Katehi, LPB||Harvey, JF||Brown, E

publication date

• March 2002

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Microwave Theory and Techniques  Journal

keywords

• High-frequency Circuits
• On-wafer Packaging
• Rf Mems
• Si Micromachining
• Three-dimensional Integration

Digital Object Identifier (DOI)

• 10.1109/22.989969

start page

• 858

end page

• 866

volume

• 50

issue

• 3

URL

• http://dx.doi.org/10.1109/22.989969