Computation of switching noise in PCBs for digital packages Conference Paper

abstract

• Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.

name of conference

• Proceedings of Electrical Performance of Electronic Packaging

authors

• Katehi, Linda

published proceedings

• Proceedings of Electrical Performance of Electronic Packaging

author list (cited authors)

• Yook, J., Chandramouli, V., Katehi, L. P., & Sakallah, K. A.

citation count

• 2

complete list of authors

• Yook, Jong-Gwan||Chandramouli, V||Katehi, LP||Sakallah, KA

publication date

• January 1995

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 3d Fem
• Circuit Analysis Computing
• Circuit Noise
• Circuit Simulation
• Computational Modeling
• Digital Packages
• Distributed Computing
• Electromagnetic Analysis
• Equivalent Circuits
• Finite Element Analysis
• Frequency Domain Analysis
• Frequency-domain Analysis
• Hspice
• Laboratories
• PCBs
• Packaging
• Printed Circuit Boards
• Printed Circuit Design
• Printed Circuits
• Spice
• Switching Noise
• Time Domain Analysis
• Time-domain Analysis
• Transmission Line Theory

Digital Object Identifier (DOI)

• 10.1109/epep.1995.524688

start page

• 37

end page

• 39

URL

• http://dx.doi.org/10.1109/epep.1995.524688