Advanced monolithic packaging concepts for high performance circuits and antennas Conference Paper

abstract

• Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.

name of conference

• 1996 IEEE MTT-S International Microwave Symposium Digest

authors

• Katehi, Linda

published proceedings

• 1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3

author list (cited authors)

• Drayton, R. F., Henderson, R. M., & Katehi, L.

citation count

• 8

complete list of authors

• Drayton, RF||Henderson, RM||Katehi, LPB

publication date

• January 1996

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE MTT-S International Microwave Symposium digest. IEEE MTT-S International Microwave Symposium  Journal

keywords

• 5 To 30 Ghz
• Antenna
• Antenna Accessories
• Back-to-back Right-angle Bend
• Conformal Micromachined Packaging
• Coupling Circuits
• Cross-coupling
• Crosstalk
• Electromagnetic Coupling
• Electromagnetic Radiation
• Frequency
• High Frequency Planar Circuit
• Laboratories
• Microstrip
• Microstrip Circuits
• Microwave Antennas
• Monolithic Packaging
• Noise Level
• Packaging
• Silicon
• Vhf Circuits

Digital Object Identifier (DOI)

• 10.1109/mwsym.1996.512247

International Standard Book Number (ISBN) 10

• 0-7803-3247-4

start page

• 1615

end page

• 1618

volume

• 3

URL

• http://dx.doi.org/10.1109/mwsym.1996.512247