Advanced monolithic packaging concepts for high performance circuits and antennas Conference Paper uri icon


  • Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.

name of conference

  • 1996 IEEE MTT-S International Microwave Symposium Digest

published proceedings

  • 1996 IEEE MTT-S International Microwave Symposium Digest

author list (cited authors)

  • Drayton, R. F., Henderson, R. M., & Katehi, L.

citation count

  • 8

complete list of authors

  • Drayton, RF||Henderson, RM||Katehi, LPB

publication date

  • January 1996