Silicon-based micromachined packages for discrete components Conference Paper

abstract

• A novel approach has been taken to develop low cost, high frequency (Ka-band), electronic packages. An existing thick film package for a phase shifter chip has been redesigned using silicon as the base material. This paper reports on the fabrication techniques and the measurement improvement found by coupling silicon micromachining techniques with standard IC processing.

name of conference

• 1997 IEEE MTT-S International Microwave Symposium Digest

authors

• Katehi, Linda

published proceedings

• 1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III

author list (cited authors)

• Henderson, R. M., & Katehi, L.

citation count

• 3

complete list of authors

• Henderson, RM||Katehi, LPB

publication date

• January 1997

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE MTT-S International Microwave Symposium digest. IEEE MTT-S International Microwave Symposium  Journal

keywords

• Costs
• Electronic Packaging
• Electronics Packaging
• Fabrication
• Frequency
• High Frequency Discrete Component
• Ic Processing
• Ka-band
• Measurement Standards
• Micromachining
• Microwave Phase Shifters
• Packaging
• Phase Shifter Chip
• Phase Shifters
• Semiconductor Device Measurement
• Si
• Silicon
• Silicon Micromachining
• Thick Films

Digital Object Identifier (DOI)

• 10.1109/mwsym.1997.602846

International Standard Book Number (ISBN) 10

• 0-7803-3814-6

start page

• 521

end page

• 524

volume

• 2

URL

• http://dx.doi.org/10.1109/mwsym.1997.602846