High frequency interconnects on silicon substrates Conference Paper

abstract

• The measured propagation constant of coplanar waveguide (CPW) on silicon wafers as a function of the line dimensions and the resistivity of the Si wafer; CPW on GaAs wafers as a function of the line dimensions; and thin film microstrip (TFMS) fabricated with polyimide on the surface of a silicon wafer is presented. It is shown that the attenuation of CPW on 2500 /spl Omega/-cm Si wafers and of TFMS with a polyimide thickness of 4 /spl mu/m or greater is comparable to the attenuation of similar lines on GaAs.

name of conference

• 1997 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Technical Papers

authors

• Katehi, Linda

published proceedings

• 1997 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM

author list (cited authors)

• Ponchak, G. E., Downey, A. N., & Katehi, L.

citation count

• 22

complete list of authors

• Ponchak, GE||Downey, AN||Katehi, LPB

publication date

• January 1997

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 40 Engineering
• 4008 Electrical Engineering

Digital Object Identifier (DOI)

• 10.1109/RFIC.1997.598751

International Standard Book Number (ISBN) 10

• 0-7803-4063-9

start page

• 101

end page

• 104

URL

• http://dx.doi.org/10.1109/rfic.1997.598751