Microtechnology in the development of three-dimensional circuits Academic Article

abstract

• With today's cost-conscience industry, low cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics are discussed and examples of multilayer three-dimensional systems utilizing micromachining are presented.

authors

• Katehi, Linda

published proceedings

• IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

altmetric score

• 6

author list (cited authors)

• Herrick, K. J., Yook, J. G., & Katehi, L.

citation count

• 53

complete list of authors

• Herrick, KJ||Yook, JG||Katehi, LPB

publication date

• January 1998

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Microwave Theory and Techniques  Journal

keywords

• Coplanar Waveguide
• Micromachining
• Microstrip
• Mmic

Digital Object Identifier (DOI)

• 10.1109/22.734496

start page

• 1832

end page

• 1844

volume

• 46

issue

• 11

URL

• http://dx.doi.org/10.1109/22.734496