A wideband CPW-to-microstrip transition for millimeter-wave packaging
Conference Paper
Overview
Research
Identity
Additional Document Info
Other
View All
Overview
abstract
A broadband single layer vertical transition from CPW to microstrip has been developed for multilayer millimeter-wave circuits. The transition has exceptionally wide bandwidth and presents low insertion and return losses. A transition has been fabricated on a 100 /spl mu/m silicon wafer that shows approximately 0.3 dB of insertion loss and better than 10 dB return loss over 75-110 GHz. This transition can be used for the vertical integration of multi-layer millimeter wave circuits and packaging.
name of conference
1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282)