Novel three-dimensional vertical interconnect technology for microwave and RF applications Conference Paper uri icon


  • In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology.

name of conference

  • 1999 IEEE MTT-S International Microwave Symposium Digest

published proceedings

  • 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282)

altmetric score

  • 3

author list (cited authors)

  • Goverdhanam, K., Simons, R. N., & Katehi, L.

citation count

  • 6

complete list of authors

  • Goverdhanam, K||Simons, RN||Katehi, LPB

publication date

  • January 1999