Novel three-dimensional vertical interconnect technology for microwave and RF applications Conference Paper uri icon

abstract

  • In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology.

altmetric score

  • 3

author list (cited authors)

  • Goverdhanam, K., Simons, R. N., & Katehi, L.

citation count

  • 7

publication date

  • January 1999

publisher