Novel three-dimensional vertical interconnect technology for microwave and RF applications Conference Paper

abstract

• In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology.

name of conference

• 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282)

authors

• Katehi, Linda

published proceedings

• 1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4

altmetric score

• 3

author list (cited authors)

• Goverdhanam, K., Simons, R. N., & Katehi, L.

citation count

• 6

complete list of authors

• Goverdhanam, K||Simons, RN||Katehi, LPB

publication date

• January 1999

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE MTT-S International Microwave Symposium digest. IEEE MTT-S International Microwave Symposium  Journal

keywords

• 3d Vertical Interconnect Technology
• CPS
• Coplanar Stripline
• Coplanar Waveguide Components
• Coplanar Waveguides
• Cpw
• Fabrication
• Finite Difference Methods
• Ic Technology
• Integrated Circuit Interconnections
• Integrated Circuit Technology
• Interconnect Fabrication Process
• Interconnect Modelling
• Microwave Integrated Circuits
• Microwave Technology
• Mmic
• Parasitic Capacitance
• Radio Frequency
• Rf Ics
• Rf Integrated Circuits
• Silicon
• Space Technology
• Strip Line Components
• Three-dimensional Interconnects
• Uhf Integrated Circuits

Digital Object Identifier (DOI)

• 10.1109/mwsym.1999.779843

International Standard Book Number (ISBN) 10

• 0-7803-5135-5

start page

• 641

end page

• 644

volume

• 2

URL

• http://dx.doi.org/10.1109/mwsym.1999.779843