Three-dimensional, W-band circuits using Si micromachining
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abstract
This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.
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1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282)