Three-dimensional, W-band circuits using Si micromachining Conference Paper

abstract

• This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.

name of conference

• 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282)

authors

• Katehi, Linda

published proceedings

• 1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4

author list (cited authors)

• Henderson, R. M., Weller, T. M., & Katehi, L.

citation count

• 4

complete list of authors

• Henderson, RM||Weller, TM||Katehi, LPB

publication date

• January 1999

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE MTT-S International Microwave Symposium digest. IEEE MTT-S International Microwave Symposium  Journal

keywords

• 3d High Density Circuits
• 3d W-band Circuits
• 90 To 94 Ghz
• Ceramics
• Coplanar Waveguide Components
• Costs
• Ehf
• Integrated Circuit Interconnections
• Integrated Circuit Packaging
• Micromachining
• Microwave Antenna Arrays
• Millimetre Wave Integrated Circuits
• Mmics
• Modules
• Multilayer Environment
• Nonhomogeneous Media
• Onwafer Packaging
• Packaging
• Phased Arrays
• Power Distribution Network
• Power Systems
• Si
• Si Micromachining
• Silicon
• Three-dimensional Circuits

Digital Object Identifier (DOI)

• 10.1109/mwsym.1999.779797

International Standard Book Number (ISBN) 10

• 0-7803-5135-5

start page

• 441

end page

• 444

volume

• 2

URL

• http://dx.doi.org/10.1109/mwsym.1999.779797