Three-dimensional, W-band circuits using Si micromachining
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This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.
author list (cited authors)
Henderson, R. M., Weller, T. M., & Katehi, L.