Three-dimensional, W-band circuits using Si micromachining Conference Paper uri icon


  • This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.

author list (cited authors)

  • Henderson, R. M., Weller, T. M., & Katehi, L.

citation count

  • 4

publication date

  • January 1999