Evaluation of ground inductance in printed circuit boards Conference Paper uri icon

abstract

  • The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.<>

name of conference

  • Proceedings of IEEE Electrical Performance of Electronic Packaging

published proceedings

  • Proceedings of IEEE Electrical Performance of Electronic Packaging

author list (cited authors)

  • Yook, J., Kurk, M., Dib, N. I., Katehi, L., & Arabi, T. R.

citation count

  • 2

complete list of authors

  • Yook, J-G||Kurk, M||Dib, NI||Katehi, LPB||Arabi, TR

publication date

  • January 1993