DEVELOPMENT OF SELF-PACKAGED HIGH-FREQUENCY CIRCUITS USING MICROMACHINING TECHNIQUES Academic Article

abstract

• A new concept for packaging high frequency monolithic circuits is presented. It consists of developing miniaturized housings to shield individual passive components (e.g., CPW based), active elements, or combinations of them by employing silicon micromachining technology. At high frequencies, self-packaged configurations that are fabricated in this manner provide reduction in the overall size and weight of a circuit and provide increased isolation between neighboring circuits. Therefore, the resulting characteristics make these micropackaged components appropriate for high density, multilevel interconnect circuits. This paper will describe the fabrication procedures used to develop self-packaged components. Performance curves for typical high frequency circuit geometries that are implemented in this configuration are shown for measured and theoretical results.<>

authors

• Katehi, Linda

published proceedings

• IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

altmetric score

• 6

author list (cited authors)

• DRAYTON, R. F., & KATEHI, L.

citation count

• 63

complete list of authors

• DRAYTON, RF||KATEHI, LPB

publication date

• January 1995

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Microwave Theory and Techniques  Journal

keywords

• Circuit Geometries
• Circuit Synthesis
• Coplanar Waveguides
• Cpw Based Elements
• Electromagnetic Shielding
• Fabrication
• Frequency
• Geometry
• Integrated Circuit Interconnections
• Integrated Circuit Packaging
• Isolation
• Micromachining
• Micromachining Techniques
• Micropackaged Components
• Millimeter Wave Technology
• Miniaturized Housings
• Mmic
• Monolithic Circuits
• Multilevel Interconnect Circuits
• Packaging
• Planar Transmission Lines
• Rlc Circuits
• Self-packaged High Frequency Circuits
• Shielding
• Silicon

Digital Object Identifier (DOI)

• 10.1109/22.414543

start page

• 2073

end page

• 2080

volume

• 43

issue

• 9