Copper film deposition using a helium dielectric barrier discharge jet Academic Article

authors

• Staack, David

published proceedings

• PLASMA PROCESSES AND POLYMERS

author list (cited authors)

• Tsai, T., Mcintyre, K., Burnette, M., & Staack, D.

citation count

• 3

complete list of authors

• Tsai, Tsung‐Chan||Mcintyre, Katelyn||Burnette, Matthew||Staack, David

publication date

• June 2020

publisher

• Wiley  Publisher

published in

• Plasma Processes and Polymers  Journal

keywords

• Atmospheric‐
• Copper(ii) Acetylacetonate
• Dielectric Barrier Discharge
• Enhanced Chemical Vapor Deposition
• Plasma‐
• Pressure Nonthermal Plasma Jet
• Thin Films

Digital Object Identifier (DOI)

• 10.1002/ppap.201900251

start page

• 1900251

end page

• 1900251

volume

• 17

issue

• 11

URL

• http://dx.doi.org/10.1002/ppap.201900251