A MIXED SOLDER GRID ARRAY AND PERIPHERAL LEADED MCM PACKAGE Conference Paper

name of conference

• Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

authors

• McShane, Michael

published proceedings

• 43RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE : 1993 PROCEEDINGS

author list (cited authors)

• HASHEMI, H., OLLA, M., COBB, D., SANDBORN, P., MCSHANE, M., HAWKINS, G., & LIN, P.

citation count

• 1

complete list of authors

• HASHEMI, H||OLLA, M||COBB, D||SANDBORN, P||MCSHANE, M||HAWKINS, G||LIN, P

publication date

• January 1993

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• Electronic Components and Technology Conference  Journal

keywords

• 40 Engineering
• 4008 Electrical Engineering
• 4009 Electronics, Sensors And Digital Hardware

Digital Object Identifier (DOI)

• 10.1109/ECTC.1993.346738

International Standard Book Number (ISBN) 10

• 0-7803-0794-1

start page

• 951

end page

• 956

URL

• http://dx.doi.org/10.1109/ectc.1993.346738