LOW-COST, THERMALLY ENHANCED QFP
Conference Paper
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Overview
published proceedings
- PROCEEDINGS OF THE 1993 INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2
author list (cited authors)
- JOINER, B., LIN, P., MCSHANE, M., PRIMEAUX, F., YOUNGBLOOD, A., & REINHARDT, R.
publication date
- January 1993