A UNIQUE LOW-COST PIN GRID ARRAY PACKAGE WITH HEATSPREADER Conference Paper
- Overview
- Additional Document Info
- View All
Overview
published proceedings
- PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2
author list (cited authors)
- MCSHANE, M., LIN, P., & WILSON, H.
complete list of authors
- MCSHANE, M||LIN, P||WILSON, H
publication date
- January 1989