Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging Conference Paper

name of conference

• 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

authors

• Shamberger, Patrick

published proceedings

• PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019)

author list (cited authors)

• Deckard, M., Shamberger, P., Fish, M., Berman, M., Wang, J., & Boteler, L.

citation count

• 16

complete list of authors

• Deckard, Michael||Shamberger, Patrick||Fish, Michael||Berman, Morris||Wang, Justin||Boteler, Lauren

publication date

• January 2019

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM  Journal

keywords

• Modeling
• Pcm
• Phase Change Material
• Simulation
• Thermal Management

Digital Object Identifier (DOI)

• 10.1109/itherm.2019.8757334

start page

• 878

end page

• 885

volume

• 00

URL

• http://dx.doi.org/10.1109/itherm.2019.8757334