Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging Conference Paper uri icon

name of conference

  • 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

published proceedings

  • 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

author list (cited authors)

  • Deckard, M., Shamberger, P., Fish, M., Berman, M., Wang, J., & Boteler, L

citation count

  • 13

complete list of authors

  • Deckard, Michael||Shamberger, Patrick||Fish, Michael||Berman, Morris||Wang, Justin||Boteler, Lauren

publication date

  • May 2019

publisher