3D printing of in-situ curing thermally insulated thermosets Academic Article

abstract

• 2019 This research reports additive manufacturing of in-situ curing thermosets using direct ink-writing (DIW) process. The investigation reveals the relationships between printing process parameters, such as extrusion pressure and operating temperature, and the resultant morphology and thermal conductivity. With the decrease of printing pressure from 125 to 25 mbar, crisscross structure appeared along with phonon boundary scattering effect which then causes 33% reduction in thermal conductivity from 0.12 Wm1K1 to 0.08 Wm1K1. The optimal cured temperature is found to be 75 C, which yields thermal conductivity of 0.1 Wm1K1 (33% decrease compared to the sample cured at 70 C) without increase the roughness of the printed surface.

authors

• Currie-Gregg, Nancy
• Pei, Zhijian
• Wang, Shiren

published proceedings

• MANUFACTURING LETTERS

altmetric score

• 3

author list (cited authors)

• Wang, B., Arias, K. F., Zhang, Z., Liu, Y., Jiang, Z., Sue, H., ... Wang, S.

citation count

• 11

complete list of authors

• Wang, Biran||Arias, Kristen F||Zhang, Zimeng||Liu, Yuchen||Jiang, Zhiyuan||Sue, Hung-Jue||Currie-Gregg, Nancy||Bouslog, Stan||Pei, Zhijian ZJ||Wang, Shiren

publication date

• January 2019

publisher

• Elsevier  Publisher

published in

• Manufacturing letters  Journal

keywords

• 3d Printing
• Additive Manufacturing
• Direct Ink-writing (diw)
• THERMOSETS

Digital Object Identifier (DOI)

• 10.1016/j.mfglet.2019.06.001

start page

• 1

end page

• 6

volume

• 21

URL

• http://dx.doi.org/10.1016/j.mfglet.2019.06.001