Quantification of Ultraprecision Surface Morphology using an Algebraic Graph Theoretic Approach Conference Paper

abstract

• 2015 Published by Elsevier B.V. Assessment of progressive, nano-scale variation of surface morphology during ultraprecision manufacturing processes, such as fine-abrasive polishing of semiconductor wafers, is a challenging proposition owing to limitations with traditional surface quantifiers. We present an algebraic graph theoretic approach that uses graph topological invariants for quantification of ultraprecision surface morphology. The graph theoretic approach captures heterogeneous multi-scaled aspects of surface morphology from optical micrographs, and is therefore valuable for in situ real-time assessment of surface quality. Extensive experimental investigations with specular finished (Sa 5 nm) blanket copper wafers from a chemical mechanical planarization (CMP) process suggest that the proposed method was able to quantify and track variations in surface morphology more effectively than statistical quantifiers reported in literature.

authors

• Bukkapatnam, Satish

published proceedings

• 43RD NORTH AMERICAN MANUFACTURING RESEARCH CONFERENCE, NAMRC 43

author list (cited authors)

• Rao, P., Bukkapatnam, S., Kong, Z., Beyca, O., Case, K., & Komanduri, R.

citation count

• 7

complete list of authors

• Rao, Prahalad||Bukkapatnam, Satish||Kong, Zhenyu||Beyca, Omer||Case, Kenneth||Komanduri, Ranga

publication date

• January 2015

publisher

• Elsevier  Publisher

published in

• Procedia Manufacturing  Journal

keywords

• Chemical Mechanical Polishing (cmp)
• Copper Cmp
• Fiedler Number
• Graph Theory
• Semiconductor Wafer Metrology
• Surface Morphology Quantification

Digital Object Identifier (DOI)

• 10.1016/j.promfg.2015.09.025

start page

• 12

end page

• 26

volume

• 1

URL

• http://dx.doi.org/10.1016/j.promfg.2015.09.025