Numerical Modeling of the Free-Molecular Micro-Resistojet Prototype and Next Generation Designs Evaluation (Invited)
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A numerical model of the temperature distribution and power consumption of the prototype Free Molecule Micro-Resistojet (FMMR) heater chip was created and validated with experiment results. Because of insufficient thin film thermophysical properties and material surface properties, a series of parametric studies were employed in the part-by-part construction of the numerical model. The best model derived produced steady-state temperature distribution and power consumption that fell within the experiment measurement errors. The numerical model was used as a quick and inexpensive tool to evaluate two new heater chip designs, where one was circular in shape and the other diamond-shaped. The new designs had a smaller planar geometry but had the same composition and would operate in the same temperature range as the prototype chip. When incorporated with isolation slots in the design, the diamondshaped chip was predicted to have an efficiency of about 1mN/W or higher when bonded to a pyrex 7740 plenum with the assumption of 50% propellant heat loss. © 2003 by. Published by the American Institute of Aeronautics and Astronautics, Inc.
author list (cited authors)
Wong, J., Ketsdever, A., & Reed, H.