Thermo-Fluidic Characteristics in a Cross-Linked Silicon Microchannel Heat Sink Conference Paper uri icon

abstract

  • This paper presents the flow and heat transfer characteristics in a cross-linked silicon microchannel heat sink. The heat sink is composed of 45 channels, 270 m wide 285 m tall in a silicon substrate formed via deep reactive ion etching. A detailed discussion of the pressure drop data reduction is described, including characterization of the channel cross-sections and methods to account for inlet and exit loss coefficients. No significant difference is observed in the pressure drop measurements between the cross-linked and standard heat sinks flowing air and water. The use of un-encapsulated liquid crystal thermography was successfully utilized to obtain local heat transfer data with FC-72 as the working fluid. The heat transfer results show inflections in the thermal profile due to the cross-links.

name of conference

  • ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference

published proceedings

  • ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2

author list (cited authors)

  • Muwanga, R., & Hassan, I.

publication date

  • January 1, 2007 11:11 AM

publisher