Miniaturization is an inevitable requirement for modern microwave and mm-wave circuits and systems. With the emerging of high frequency monolithic integrated circuits, it is the passive components' section that usually occupies the most of the area. As a result, developing creative miniaturization techniques in order to reduce the physical sizes of passive components while keep their high performance characteristics is demanding. On the other hand, it is the application that defines the importance and effectiveness of the miniaturization method. For example, in commercial handset wireless communication systems, it is the portability that primarily dictates miniaturization. However, in case of liquid sensing applications, the required volume of the sample, cost, or other parameters might impose size limitations. In this thesis, various microwave and mm-wave miniaturization methods are introduced. The methods are applied to various passive components and blocks in different applications to better study their effectiveness. Both componentlevel designs and system-level hybrid integration are benefited from the miniaturization methods introduced in this thesis. The proposed methods are also experimentally tested, and the results show promising potential for the proposed methods.
