IC performance prediction system Conference Paper uri icon

abstract

  • This paper presents a methodology for predicting the electrical performance of integrated circuits prior to packaging and final test. A simulation-based approach is used to build response surface prediction models. The work focuses on determining the optimal set of test measurements required for on-line product-based control, package selection, binning and die selection for MCMs.

author list (cited authors)

  • Ramakrishnan, V., & Walker, D.

publication date

  • December 1995