Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes
- Additional Document Info
- View All
2011-2012 IEEE. We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm2-K, while dissipating a heat flux of 1 kW/cm2. When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
author list (cited authors)
Lu, Z., Salamon, T. R., Narayanan, S., Bagnall, K. R., Hanks, D. F., Antao, D. S., ... Wang, E. N.
complete list of authors
Lu, Zhengmao||Salamon, Todd R||Narayanan, Shankar||Bagnall, Kevin R||Hanks, Daniel F||Antao, Dion S||Barabadi, Banafsheh||Sircar, Jay||Simon, Maria E||Wang, Evelyn N