PROFILE OF ELECTROCHEMICALLY MACHINED MICROCOMPONENTS
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abstract
Traditional micromachining uses silicon to fabricate microcomponents. Since silicon is not suitable for applications that demand high strength, robustness and biocompatibility, alternative micromanufacturing processes are sought. The non-traditional electrochemical micromachining (ECM) process is precise, non-contact, repeatable, and applicable to all conductive materials regardless of their mechanical properties. This paper examines effects of ECM parameters on profiles of micropatterns. A square-wave current forms micropatterns on an anodic workpiece with undercut due to electrochemical reaction and different mass transport mechanisms. Though-mass ECM process produces an undercut that is largest between the electrodes and is reduced outwardly. An ECM process with high frequency pulses produces sharp profiles and reduces undercut at the expense of material removal rate. Although sharp corners can be formed at internal angles, rounded corners at external corners resulted due to combined edge effects. When utilized at a high frequency and an enhanced material removal rate, the ECM could become a suitable process for mass production of robust microsystems.
