Reduction of boride-enhanced diffusion by point defect engineering and its application for shallow junction formation
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Point defect engineering using high energy ion bombardment can be used as a method to inject vacancies near the surface region with excessive interstitials created near the end of the projected range. We demonstrated that implantation of MeV Si ions into a Si substrate can suppress boride-enhanced diffusion normally associated with a high B concentration layer. The concept of boron diffusion control can be used as an approach to form ultra-shallow junction. 2003 Elsevier Science B.V. All rights reserved.