A surface micromachined, out-of-plane anemometer Conference Paper uri icon

abstract

  • A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250°C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-μs with a wire thickness of 1000 Å and 50-μm in length.

author list (cited authors)

  • Chen, J., Zou, J., & Liu, C.

publication date

  • January 2002