A surface micromachined, out-of-plane anemometer
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A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250C). Hence the process can be realized on non-silicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-s with a wire thickness of 1000 and 50-m in length.
Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
author list (cited authors)
Chen, J., Zou, J., & Liu, C.
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