Development of Three-Dimensional Inductors Using Plastic Deformation Magnetic Assembly (PDMA) Academic Article

abstract

• On-chip inductors are critical for enabling portable power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of two types of on-chip three-dimensional (3-D) inductors - a vertical spiral inductor and a solenoid inductor - by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.

authors

• Zou, Jun

published proceedings

• IEEE Transactions on Microwave Theory and Techniques

altmetric score

• 3

author list (cited authors)

• Zou, J., Liu, C., Trainor, D. R., Chen, J., Schutt-Ain, J. E., & Chapman, P. L.

citation count

• 69

complete list of authors

• Zou, Jun||Liu, Chang||Trainor, Drew R||Chen, Jack||Schutt-Ainé, Jose E||Chapman, Patrick L

publication date

• April 2003

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Microwave Theory and Techniques  Journal

Digital Object Identifier (DOI)

• 10.1109/tmtt.2003.809674

start page

• 1067

end page

• 1075

volume

• 51

issue

• 4

URL

• http://dx.doi.org/10.1109/tmtt.2003.809674