A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems Academic Article

abstract

• A new low-temperature biochemically compatible polymer bonding process has been successfully developed. The bonding has been characterized for bond strength and chemical resistance. This technique has successfully addressed a major challenge in the development of microfluidic systems from discrete components by enabling the bonding of the components to the microfluidic motherboards at low temperatures and ensuring reliable, leak-proof and chemically inert bonding. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer. The bonding technique lowers the bonding temperature (160C), shows a good bond strength of 4.3 MPa in silicon-to-silicon, and has excellent chemical resistance to various chemicals used in microelectromechanical systems processing.

authors

• Han, Arum

published proceedings

• JOURNAL OF MICROMECHANICS AND MICROENGINEERING

author list (cited authors)

• Oh, K. W., Han, A., Bhansali, S., & Ahn, C. H.

citation count

• 78

complete list of authors

• Oh, KW||Han, A||Bhansali, S||Ahn, CH

publication date

• March 2002

publisher

• IOP Publishing  Publisher

published in

• Journal of Micromechanics and Microengineering  Journal

keywords

• 40 Engineering
• 4016 Materials Engineering
• Biotechnology

Digital Object Identifier (DOI)

• 10.1088/0960-1317/12/2/313

start page

• 187

end page

• 191

volume

• 12

issue

• 2

URL

• http://dx.doi.org/10.1088/0960-1317/12/2/313