A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems Academic Article

abstract

• A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOPTM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160 C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.

authors

• Han, Arum

published proceedings

• 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)

author list (cited authors)

• Han, A., Oh, K. W., Bhansali, S., Henderson, H. T., & Ahn, C. H.

citation count

• 19

complete list of authors

• Han, A||Oh, KW||Bhansali, S||Henderson, H Thurman||Ahn, CH

publication date

• January 2000

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)  Journal

Digital Object Identifier (DOI)

• 10.1109/memsys.2000.838553

start page

• 414

end page

• 418

URL

• http://dx.doi.org/10.1109/memsys.2000.838553