A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality Conference Paper uri icon

abstract

  • 2002 IEEE. A multi-layer plastic packaging technology has been developed for microfluidic systems containing electrical and mechanical functionality. Hot embossing and heat staking of plastics, micro stenciling of electrodes, and stereolithography was combined with conventional MEMS fabrication techniques to realize the system. The approach allows for multiple materials of fabrication, provides a solution to integration of electrical functionality throughout the system, and provides an interconnect technology for interfacing fluids and electrical components between the macro and the micro worlds.

name of conference

  • 2nd Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology. Proceedings (Cat. No.02EX578)

published proceedings

  • 2ND ANNUAL INTERNATIONAL IEEE-EMBS SPECIAL TOPIC CONFERENCE ON MICROTECHNOLOGIES IN MEDICINE & BIOLOGY, PROCEEDINGS

author list (cited authors)

  • Han, A., Wang, O., Mohanty, S. K., Graff, M., & Frazier, A. B.

citation count

  • 4

complete list of authors

  • Han, A||Wang, O||Mohanty, SK||Graff, M||Frazier, AB

publication date

  • January 2002