Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding Conference Paper uri icon


  • Control of the bonding process is important in the high volume manufacture of MEMS gyroscope. This paper reports on the use of in situ, aligned, current-limited anodic bonding to enable the required device throughput and control of the bonding process. Statistical analysis of stress-sensitive output parameters of the gyroscope is used to quantify the benefits of different bonding procedures. Current limiting is shown to improve device-to-device reproducibility and the in situ capability of the combined aligner-bonder equipment enables high-throughput manufacturing and yield improvements. Cycle times for the aligned anodic bond process were reduced from 40 to 20 min, and wafer bow reduced by 20%. This reduction in wafer bow translated directly into improved device performance and reproducibility. 2005 Elsevier B.V. All rights reserved.

published proceedings

  • Sensors and Actuators A Physical

author list (cited authors)

  • Rogers, T., Aitken, N., Stribley, K., & Boyd, J.

citation count

  • 29

complete list of authors

  • Rogers, Tony||Aitken, Nick||Stribley, Kevin||Boyd, James

publication date

  • September 2005