Finite element analysis of electric-field-assisted bonding Conference Paper uri icon


  • An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss' law, and the linear momentum equations are placed in a finite element formulation, which is used to predict the evolution of the sodium ion concentration, electric potential, and stress during anodic bonding of Pyrex glass and silicon.

name of conference

  • Smart Structures and Materials 2000: Active Materials: Behavior and Mechanics

published proceedings

  • Proceedings of SPIE

author list (cited authors)

  • Boyd, J. G., & Enikov, E. T.

citation count

  • 0

complete list of authors

  • Boyd, James G||Enikov, Eniko T

editor list (cited editors)

  • Lynch, C. S.

publication date

  • June 2000