Finite element analysis of electric-field-assisted bonding Conference Paper

abstract

• An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss' law, and the linear momentum equations are placed in a finite element formulation, which is used to predict the evolution of the sodium ion concentration, electric potential, and stress during anodic bonding of Pyrex glass and silicon.

name of conference

• Smart Structures and Materials 2000: Active Materials: Behavior and Mechanics

authors

• Boyd, James

published proceedings

• Proceedings of SPIE

author list (cited authors)

• Boyd, J. G., & Enikov, E. T.

citation count

• 0

complete list of authors

• Boyd, James G||Enikov, Eniko T

editor list (cited editors)

• Lynch, C. S.

publication date

• June 2000

publisher

• SPIE, the international society for optics and photonics  Publisher

published in

• Proceedings of SPIE  Journal

Digital Object Identifier (DOI)

• 10.1117/12.388215

start page

• 306

end page

• 318

volume

• 3992