Electroplated electro-fluidic interconnects for chemical sensors11This work was completed at The Microfabrication Applications Laboratory at The Universityof Illinois at Chicago. Academic Article uri icon


  • A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connection to a silicon multi-chip module. A hermetic seal is obtained using the gold-silicon eutectic bond. The sensor's electrical connections to the multi-chip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical connections are made simultaneously, and the process is compatible with the flip-chip bonding technique.

published proceedings

  • Sensors and Actuators A Physical

altmetric score

  • 3

author list (cited authors)

  • Enikov, E. T., & Boyd, J. G.

citation count

  • 5

complete list of authors

  • Enikov, Eniko T||Boyd, James G

publication date

  • August 2000