Fabrication of vapor-deposited micro heat pipe arrays as an integral part of semiconductor devices Academic Article uri icon

abstract

  • Vapor-deposited micro heat pipe arrays (VDMHP) were fabricated as an integral part of semiconductor devices to act as efficient heat spreaders by reducing the thermal path between the heat sources and heat sink. Fabrication of the VDMHP was accomplished by first establishing a series of grooves in a silicon wafer. Orientation dependent etching (ODE) using a KOH-1-propanol-H2O solution on a (100) wafer with a (111) flat covered with an oxide mask, resulted in grooves 25 m wide and 25 m deep with sharp, perpendicular edges. The wafers were predeposited with a layer of chromium followed by a layer of gold to improve the adhesion characteristics. Dual electron beam vapor deposition, followed by planetary process using molybdenum crucibles, were used to deposit copper 31.5-33.0 m thick, and provide complete closure of the grooves. A glass cover slip was bonded on the top of the deposited layer. The grooves were finally charged and sealed. A computer model Simulation and Modeling of Evaporated Deposition Profiles (SAMPLE) was used to optimize the metal step coverage and successfully predict the cross-sectional profile of the VDMHP. [113]. 1995 IEEE

published proceedings

  • Journal of Microelectromechanical Systems

altmetric score

  • 3

author list (cited authors)

  • Mallik, A. K., Peterson, G. P., & Weichold, M. H.

citation count

  • 44

complete list of authors

  • Mallik, AK||Peterson, GP||Weichold, MH

publication date

  • January 1995