Analysis of arbitrarily shaped coax-fed microstrip antennas with thick substrates
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microstrip patch antennas with thick substrates are studied using a mixed-potential integral equation approach. This incorporates a triangle-element model of the patch and a rigorous treatment of the probe-topatch junction. Computed input impedance data are shown to agree well with measured results. © 1990, The Institution of Electrical Engineers. All rights reserved.
author list (cited authors)
Zheng, D., & Michalski, K. A.