Comparison of wafer-level spatial I-DDQ estimation methods: NNR versus NCR
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abstract
Extending the useful life of IDDQtest to deep submicron technologies has been a topic of interest in recent years. IDDQtest loses its effectiveness as the signal to noise ratio degrades due to rising background current and fault-free IDDQvariance. Defect detection using IDDQtest requires separation of deterministic sources of variation from defective current. Several methods that use deterministic variation in IDDQat the wafer level for estimating fault-free IDDQof a chip are proposed. This paper compares two such methods: Nearest Neighbor Residual (NNR) and Neighbor Current Ratio (NCR). These methods are evaluated using industrial test data for a recent technology. 2004 IEEE.
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Proceedings. 2004 IEEE International Workshop on Current and Defect Based Testing (IEEE Cat. No.04EX1004)