Boron-Based Nanoparticles for Chemical-Mechanical Polishing of Copper Films
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Boron nanoparticles (NPs) were synthesized using a home-built chemical vapor deposition system. These NPs were crystallized at 900C that is lower than previous report. The size of boron NPs ranged from 5 nm to 1 m. This was achieved by varying the volatilizing temperature of boron tribromide. Subsequently, boron NPs were oxidized by heat-treatment in air. Small-size oxidized boron NPs were investigated as an additive to SiO 2 slurry. It was found that the slurry has an enhanced chemical-mechanical planarization (CMP) performance with the addition of those boron NPs. Results showed that the copper removal rate was increased while friction coefficient was reduced, a desirable condition for optimizing CMP processes. The outcome of this research is beneficial to process improvement in semiconductor industry. 2012 The Electrochemical Society.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
author list (cited authors)
He, X., Joo, S., Xiao, H., & Liang, H.
complete list of authors
He, Xingliang||Joo, Sukbae||Xiao, Huaping||Liang, Hong