A novel plasma-based copper dry etching method Academic Article

authors

• Kuo, Yue

published proceedings

• JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS

author list (cited authors)

• Kuo, Y., & Lee, S.

citation count

• 31

complete list of authors

• Kuo, Y||Lee, S

publication date

• March 2000

publisher

• IOP Publishing  Publisher

published in

• Japanese Journal of Applied Physics  Journal

keywords

• Copper Dry Etching
• Copper Swelling
• Plasma Etching
• Plasma-copper Reaction

Digital Object Identifier (DOI)

• 10.1143/JJAP.39.L188

start page

• L188

end page

• L190

volume

• 39

issue

• 3AB