A Novel Plasma-Based Copper Dry Etching Method Academic Article

authors

• Kuo, Yue

author list (cited authors)

• Kuo, Y., & Lee, S.

citation count

• 24

publication date

• March 2000

publisher

• IOP Publishing  Publisher

published in

• Japanese Journal of Applied Physics  Journal

keywords

• Copper Dry Etching
• Copper Swelling
• Plasma Etching
• Plasma-copper Reaction

Digital Object Identifier (DOI)

• 10.1143/jjap.39.l188

start page

• l188

end page

• l190

volume

• 39

issue

• Part 2, No. 3A/B