Wild Tetraploid Wheat (Triticum turgidum L.) Response to Heat Stress
- Additional Document Info
- View All
Identifying reliable screening tools and characterizing tolerant germplasm sources are essential for developing wheat (Triticum aestivum L.) varieties suited for the hot areas of the world. Our objective was to evaluate heat tolerance of promising wild tetraploid wheat (Triticum turgidum L.) accessions that could be used as sources of heat tolerance in common- and durum-wheat (Triticum durum) breeding programs. We screened 16 wild tetraploid wheat accessions and two common wheat checks for their response to heat stress by measuring damage to the thy- lakoid membranes, flag leaf temperature depression (FLTD), and spike temperature depression (STD) during exposure to heat stress for 16 days post-anthesis (DPA). Measurements were taken on the day of anthesis then 4, 8, 12, 16 DPA under controlled optimum and heat-stress conditions. Individual kernel weight (IKW) and heat susceptibility index (HSI) measurements were also obtained. Prolonged exposure to heat stress was associated with increased damage to thylakoid membranes, as indicated by the high ratio of constant fluorescence (O) to peak variable fluorescence (P). Some wild tetraploid wheat accessions exhibited a better HSI than the common heat-tolerant wheat cultivar 'Kauz.' A positive and significant correlation was found between O/P ratio and each of FLTD and STD under heat-stress conditions. A negative and significant correlation was found between FLTD and HSI and between STD and HSI based on the second and third measurements (4 and 8 DPA). Correlations obtained after the third measurement were not significant because of heat-induced, accelerated maturity and a lack of green leaf tissue. This study identified potential heat-tolerant wild tetraploid wheat germplasm that can be incorporated into wheat breeding programs to improve heat tolerance in cultivated common and durum wheat. © Taylor & Francis Group, LLC.
author list (cited authors)
Ali, M. B., Ibrahim, A., Hays, D. B., Ristic, Z., & Fu, J.