Novel plasma-based copper dry etching method
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A new copper dry etching method has been discovered and studied. The process on an unique HCl plasma-copper reaction that forms a solution soluble copper chloride compound. The physical (e.g., morphology, profile, volume expansion, and anisotropy) and chemical (e.g., reaction mechanism) aspects of the solid-state copper chloride growth mechanism have been delineated. This new process is applicable to the copper interconnection technology for advanced microelectronic and optoelectronic devices and circuits.
Japanese Journal of Applied Physics, Part 2: Letters
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