publication venue for
- The Time Domain Propagator Method for Lossless Multiconductor Quasi-TEM Lines. 32:619-626. 2009
- Characterization of Parylene-N as Flexible Substrate and Passivation Layer for Microwave and Millimeter-Wave Integrated Circuits. 32:84-92. 2009
- Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages. 24:76-80. 2001
- The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages. 23:88-99. 2000