Analysis tool and methodology design for electronic vibration stress understanding and prediction Conference Paper uri icon


  • The objectives of this research were to (1) understand the impact of vibration on electronic components under ultrasound excitation; (2) model the thermal profile presented under vibration stress; and (3) predict stress level given a thermal profile of an electronic component. Research tasks included: (1) retrofit of current ultrasonic/infrared nondestructive testing system with sensory devices for temperature readings; (2) design of software tool to process images acquired from the ultrasonic/infrared system; (3) developing hypotheses and conducting experiments; and (4) modeling and evaluation of electronic vibration stress levels using a neural network model. Results suggest that (1) an ultrasonic/infrared system can be used to mimic short burst high vibration loads for electronics components; (2) temperature readings for electronic components under vibration stress are consistent and repeatable; (3) as stress load and excitation time increase, temperature differences also increase; (4) components that are subjected to a relatively high pre-stress load, followed by a normal operating load, have a higher heating rate and lower cooling rate. These findings are based on grayscale changes in images captured during experimentation. Discriminating variables and a neural network model were designed to predict stress levels given temperature and/or grayscale readings. Preliminary results suggest a 15.3% error when using grayscale change rate and 12.8% error when using average heating rate within the neural network model. Data were obtained from a high stress point (the corner) of the chip.

name of conference

  • Thermosense XXVII

published proceedings

  • Proceedings of SPIE

author list (cited authors)

  • Hsieh, S., Crane, R. L., & Sathish, S.

citation count

  • 0

complete list of authors

  • Hsieh, Sheng-Jen||Crane, Robert L||Sathish, Shamachary

editor list (cited editors)

  • Peacock, G. R., Burleigh, D. D., & Miles, J. J.

publication date

  • March 2005