Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis Conference Paper uri icon


  • A methodology based on active infrared thermography to study and characterize hidden solder joint shapes on a multi cover PCB assembly was investigated. A numerical model was developed to simulate the active thermography methodology and was proven to determine the grand average cooling rates with maximum errors of 8.85% (one cover) and 13.36% (two covers). A parametric analysis was performed by varying the number of covers, heat flux provided, and the amount of heating time. Grand average cooling rate distances among contiguous solder joint shapes, as well as solder joints discriminability, were determined to be directly proportional to heat flux, and inversely proportional to the number of covers and heating time. Finally, a mathematical model was developed to determine the appropriate total amount of energy needed to discriminate among hidden solder joints with a "good" discriminability for one and two covers, and a "regular" discriminability for up to five covers. The mathematical model was proven to predict the total amount of energy to achieve a "good" discriminability for one cover within a 10% of error with respect to the experimental active thermography model. 2014 Copyright SPIE.

name of conference

  • Thermosense: Thermal Infrared Applications XXXVI

published proceedings


author list (cited authors)

  • Palomares, J., & Hsieh, S.

citation count

  • 0

complete list of authors

  • Palomares, Jose Benjamin Giron||Hsieh, Sheng-Jen Tony

editor list (cited editors)

  • Colbert, F. P., & Hsieh, S.

publication date

  • May 2014