Effect of Grinding Parameters on Surface Finish of Ground Ceramics
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Experimental research has been conducted into the effect of grinding parameters on surface finish of ground hot pressed silicon nitride. Wheel grit size and machine parameters of wheel depth of cut and workspeed in surface grinding have been investigated. The relationships between surface finish and the grinding parameters of grit size, grit depth of cut, surface scallop height, chip cross-sectional area, and theoretical cutting edge spacing are explored. Two unique relationships appear to exist between surface finish and chip cross-sectional area; one below chip cross-sectional area of 0.1 μm2 and another above this value. The relationship between surface finish and theoretical cutting edge spacing shows the best fit for all test data. © 1995 CIRP.
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