Effect of Grinding Parameters on Surface Finish of Ground Ceramics Academic Article

abstract

• Experimental research has been conducted into the effect of grinding parameters on surface finish of ground hot pressed silicon nitride. Wheel grit size and machine parameters of wheel depth of cut and workspeed in surface grinding have been investigated. The relationships between surface finish and the grinding parameters of grit size, grit depth of cut, surface scallop height, chip cross-sectional area, and theoretical cutting edge spacing are explored. Two unique relationships appear to exist between surface finish and chip cross-sectional area; one below chip cross-sectional area of 0.1 m2 and another above this value. The relationship between surface finish and theoretical cutting edge spacing shows the best fit for all test data. 1995 CIRP.

authors

• Fang, Gwo-Ping

published proceedings

• CIRP Annals

author list (cited authors)

• Mayer, J. E., & Fang, G.

citation count

• 39

complete list of authors

• Mayer, JE||Fang, G-P

publication date

• January 1995

publisher

• Elsevier  Publisher

published in

• CIRP annals  Journal

Digital Object Identifier (DOI)

• 10.1016/s0007-8506(07)62325-7

start page

• 279

end page

• 282

volume

• 44

issue

• 1

URL

• http%3A%2F%2Fdx.doi.org%2F10.1016%2Fs0007-8506%2807%2962325-7