Prediction of long-term creep behavior of epoxy adhesives for aluminum substrates Conference Paper uri icon


  • Epoxy-based adhesives for bonding aluminum substrates have gathered significant interest in recent years. Yet, more work is needed to learn how epoxy adhesives withstand creep and exposure to various environmental conditions. In this study, both experimental and modeling work (using Ngai's Coupling) has been conducted to predict creep behavior of epoxy adhesives under moisture exposure.

published proceedings

  • Annual Technical Conference - ANTEC, Conference Proceedings

author list (cited authors)

  • Feng, C. W., Keong, C. W., Hsueh, Y. P., Wang, Y. Y., & Sue, H. J.

complete list of authors

  • Feng, CW||Keong, CW||Hsueh, YP||Wang, YY||Sue, HJ

publication date

  • June 2004